? semiconductor components industries, llc, 2012 january, 2012 ? rev. 0 1 publication order number: P2I2305NZ/d P2I2305NZ 3.3v 1:5 clock buffer functional description P2I2305NZ is a low cost high speed buffer designed to accept one clock input and distribute up to five clocks in mobile pc systems and desktop pc systems. the device operates at 3.3 v and outputs can run up to 133.33 mhz. P2I2305NZ is designed for low emi and power optimization and consumes less than 32 ma at 66.6 mhz, making it ideal for the low ? power requirements of mobile systems. it is available in an 8 ? pin soic package over industrial temperature range. features ? one ? input to five ? output buf fer/driver ? buffers all frequencies from dc to 133.33 mhz ? low power consumption for mobile applications ? less than 32 ma at 66.6 mhz with unloaded outputs ? input ? output delay: 6 ns(max) ? output ? output skew less than 250 ps ? supply voltage: 3.3 v 0.3 v ? operating temperature range: ? 40 c to +85 c ? 8 ? pin soic package ? these devices are pb ? free, halogen free/bfr free and are rohs compliant block diagram figure 1. block diagram buf_in output1 output2 output3 output4 output5 soic ? 8 d suffix case 751 marking diagram http://onsemi.com xx = specific device code a = assembly location l = wafer lot y = year w = work week = pb ? free package alyw 1 8 1 8 see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information
P2I2305NZ http://onsemi.com 2 pin configuration figure 2. P2I2305NZ pin configuration (top view) output3 output4 v dd output5 buf_in output1 output2 gnd 1 2 3 45 6 7 8 table 1. pin description pin# pin name description 6 v dd 3.3 v, supply voltage 4 gnd ground 1 buf_in clock input 2, 3, 5, 7, 8 output [1:5] clock outputs table 2. absolute maximum ratings parameter min max unit supply voltage to ground potential ? 0.5 +4.6 v dc input voltage (except ref) ? 0.5 v dd + 0.5 v dc input voltage (ref) ? 0.5 7 v storage temperature ? 65 +150 c max. soldering temperature (10 sec) 260 c junction temperature 150 c static discharge voltage (as per jedec std22 ? a114 ? b) 2000 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. table 3. operating conditions parameter description min max unit v dd supply voltage 3.0 3.6 v t a operating temperature ? 40 85 c c l load capacitance, f out < 100 mhz 30 pf load capacitance, 100 mhz < f out < 133.33 mhz 15 pf c in input capacitance 7 pf buf_in, output [1:5] operating frequency dc 133.33 mhz t pu power ? up time for all v dd ?s to reach minimum specified voltage (power ramps must be monotonic) 0.05 50 ms
P2I2305NZ http://onsemi.com 3 table 4. dc characteristics v dd = 3.0 v to 3.6 v, gnd = 0 v, t a = 40 c to +85 c symbol parameter test conditions min max unit v il input low voltage (note 1) 0.8 v v ih input high voltage (note 1) 2.2 v i il input low current v in = 0 v 50.0 a i ih input high current v in = v dd 100.0 a v ol output low voltage (note 2) i ol = 12 ma 0.4 v v oh output high voltage (note 2) i oh = ? 12 ma 2.4 v i dd supply current unloaded outputs at 66.66 mhz 32 ma 1. buf_in input has a threshold voltage of v dd /2. 2. parameter is guaranteed by design and characterization. it is not tested in production. table 5. ac characteristics (note 3) v dd = 3.0 v to 3.6 v, gnd = 0 v, t a = 40 c to +85 c symbol parameter test conditions min typ max unit t 3 rise time (note 4) measured between 0.8 v and 2.0 v 1.5 2 ns t 4 fall time (note 4) measured between 2.0 v and 0.8 v 1.5 2 ns t d duty cycle (note 4) = t 2 t 1 measured at 1.4 v (for an input clock duty cycle 50%) 45 50 55 % t 5 output to output skew (note 4) all outputs equally loaded 250 ps t 6 propagation delay, buf_in rising edge to output rising edge (note 4) measured at v dd /2 4 6 ns 3. all parameters specified with loaded outputs. 4. parameter is guaranteed by design and characterization. it is not tested in production.
P2I2305NZ http://onsemi.com 4 switching waveforms duty cycle timing t 2 output 1.4 v 1.4 v 1.4 v t 1 all outputs rise/fall time output 0.8 v 0.8 v 2 v 2 v t 3 t 4 output ? output skew output 1.4 v 1.4 v output t 5 input ? output propagation delay figure 3. switching waveforms t 6 output input v dd /2 v dd /2 figure 4. test circuit buf_in gnd +3.3 v output cl 0.1 f v dd
P2I2305NZ http://onsemi.com 5 ordering information device marking package shipping ? P2I2305NZg ? 08sr adb soic ? 8 (pb ? free) 2500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *a ?microdot? placed at the end of last row of marking or just below the last row toward the center of package indicates pb ? free.
P2I2305NZ http://onsemi.com 6 package dimensions soic ? 8 nb case 751 ? 07 issue ak seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. sc illc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems in tended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scill c and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding th e design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resa le in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 P2I2305NZ/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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